This product is used in device packages such as pressure sensors, temperature sensors and MEMS sensors.
General performance:
Air tightness: ≤1×10-3Pa·cm3/s
Lead insulation resistance: ≥1×109Ω
Implementation standards:
The indicators meet the requirements of GJB2440-2006 "General Specification for Hybrid Integrated Circuit Enclosures".
* Can be customized according to different specifications of customers.