Photoelectric / Laser Device Shell Series

Photoelectric / laser device type housing

Performance characteristics:

This product is used in optical communication, microwave packaging, industrial laser, power electronics and other fields.

product details

General performance:

Air tightness: ≤1×10-3Pa·cm3/s

Lead insulation resistance: ≥1×109Ω

Implementation standards:

The indicators meet the requirements of GJB2440-2006 "General Specification for Hybrid Integrated Circuit Enclosures".

* Can be customized according to different specifications of customers.